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STM32F205RBT7

STMICROELECTRONICS

LQFP64 128K FLASH 64K RAM US

STM32F205RBT7
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below 17/02/2025
Total Stock Due 1920
Total Reserved Stock Due 0
Supplier Lead Time (wk) 12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 160
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 160
Order Multiple 160
Package Type: Tray IC
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 3A991A2

Specification

BrandSTMICROELECTRONICS
Core Size32 bit
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: PIL_MMS-MIC/12/7220_13/04/20121
Description: Decrease Low Speed Oscillator consumption for low power applications
Date of Issue: 13/04/2012 00:00:00
PCN1PCN2
PCN Number: PCN MMS-MIC_12_7248
Description: Package assembly material change
Date of Issue: 30/04/2012 00:00:00
PCN1PCN2
PCN Number: PCN_PIL MMS-MIC_12_7264_11/05/2012
Description: Decrease Low Speed Oscillator consumption for low power applications
Date of Issue: 11/05/2012 00:00:00
PCN1PCN2
PCN Number: PIL MMS-MIC_12_7428
Description: Additional EWS site for STM8 and STM32 devices - Standard products
Date of Issue: 14/08/2012 00:00:00
PCN1
PCN Number: PIL MMS-MIC_12_7299
Description: additional USB peripheral
Date of Issue: 20/07/2012 00:00:00
PCN1
PCN Number: PIL MMS-MIC_12_7477
Description: Current consumption Reduction in VBAT mode
Date of Issue: 11/09/2012 00:00:00
PCN1PCN2
PCN Number: PCN 7747
Description: ST Crolles Wafer Fab additional source in 12" wafers
Date of Issue: 18/03/2013 00:00:00
PCN1
PCN Number: PIL MMS-MIC_13_8156
Description: STM32F2xx EMI characteristics update
Date of Issue: 16/10/2013 00:00:00
PCN1
PCN Number: PCN MMS-MIC_14_8363
Description: Additional assembly and test site sourcing
Date of Issue: 31/03/2014 00:00:00
PCN1
PCN Number: ST_PCN MMS-MIC_14_8461
Description: Low-speed external oscillator improvement
Date of Issue: 01/07/2014 00:00:00
PCN1
PCN Number: st_PCN_MDG_17_9976
Description: Transfer assembly plant from Stats ChipPAC Shanghai China (SCC) to Stats ChipPAC Jiangyin China (JSCC)
Date of Issue: 03/03/2017 00:00:00
PCN1PCN2
PCN Number: st_PCN 10333
Description: TSMC (Taiwan) additional source for STM32F209 1MB & STM32F46 1MB products in M10/90nm technology
Date of Issue: 24/11/2017 00:00:00
PCN1
PCN Number: st_PCN MDG_18_10548
Description: ASE Kaohsiung (Taiwan) additional source for LQFP 7x7 & LQFP 10x10 extended listed products
Date of Issue: 14/12/2018 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_20_12050
Description: JSCC capacity increase - for listed products
Date of Issue: 13/03/2020 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: ST-PCN12791 Die 2128
Description: Die Redesign
Date of Issue: 16/07/2021 00:00:00
PCN1
PCN Number: st_PCN_MDG_23_13841
Description: Copper palladium bonding wire introduction
Date of Issue: 28/02/2023 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
160£4.69000
320£4.50000
480£4.32000
640£4.21000
800+£4.18000
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