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Semiconductors
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Microcontroller & DSP
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Microcontrollers
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32 Bit MCU's
STM32F205RBT7
STMICROELECTRONICS
LQFP64 128K FLASH 64K RAM US
Image is for illustrative purposes only. Please refer to product data sheet.
Availability
Stock
0
Reserved Stock
0
Stock Due Date
Date next shipment is due, this may not be for the full quantity shown below
17/02/2025
Total Stock Due
1920
Total Reserved Stock Due
0
Supplier Lead Time (wk)
(See Lead Time Forecast)
12
Standard Pack Qty
non-stocked items may be subject to a higher supplier minimum order quantity
160
Minimum Order Qty
non-stocked items may be subject to a higher supplier minimum order quantity
160
Order Multiple
160
Package Type: Tray IC
RoHS:
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 3A991A2
Specification
›
Brand
STMICROELECTRONICS
Core Size
32 bit
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details
PCN PTN
›
PCN (Product Change Notification)
PCN Number: PIL_MMS-MIC/12/7220_13/04/20121
Description: Decrease Low Speed Oscillator consumption for low power applications
Date of Issue: 13/04/2012 00:00:00
PCN Number: PCN MMS-MIC_12_7248
Description: Package assembly material change
Date of Issue: 30/04/2012 00:00:00
PCN Number: PCN_PIL MMS-MIC_12_7264_11/05/2012
Description: Decrease Low Speed Oscillator consumption for low power applications
Date of Issue: 11/05/2012 00:00:00
PCN Number: PIL MMS-MIC_12_7428
Description: Additional EWS site for STM8 and STM32 devices - Standard products
Date of Issue: 14/08/2012 00:00:00
PCN Number: PIL MMS-MIC_12_7299
Description: additional USB peripheral
Date of Issue: 20/07/2012 00:00:00
PCN Number: PIL MMS-MIC_12_7477
Description: Current consumption Reduction in VBAT mode
Date of Issue: 11/09/2012 00:00:00
PCN Number: PCN 7747
Description: ST Crolles Wafer Fab additional source in 12" wafers
Date of Issue: 18/03/2013 00:00:00
PCN Number: PIL MMS-MIC_13_8156
Description: STM32F2xx EMI characteristics update
Date of Issue: 16/10/2013 00:00:00
PCN Number: PCN MMS-MIC_14_8363
Description: Additional assembly and test site sourcing
Date of Issue: 31/03/2014 00:00:00
PCN Number: ST_PCN MMS-MIC_14_8461
Description: Low-speed external oscillator improvement
Date of Issue: 01/07/2014 00:00:00
PCN Number: st_PCN_MDG_17_9976
Description: Transfer assembly plant from Stats ChipPAC Shanghai China (SCC) to Stats ChipPAC Jiangyin China (JSCC)
Date of Issue: 03/03/2017 00:00:00
PCN Number: st_PCN 10333
Description: TSMC (Taiwan) additional source for STM32F209 1MB & STM32F46 1MB products in M10/90nm technology
Date of Issue: 24/11/2017 00:00:00
PCN Number: st_PCN MDG_18_10548
Description: ASE Kaohsiung (Taiwan) additional source for LQFP 7x7 & LQFP 10x10 extended listed products
Date of Issue: 14/12/2018 00:00:00
PCN Number: st_PCN MDG_20_12050
Description: JSCC capacity increase - for listed products
Date of Issue: 13/03/2020 00:00:00
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN Number: ST-PCN12791 Die 2128
Description: Die Redesign
Date of Issue: 16/07/2021 00:00:00
PCN Number: st_PCN_MDG_23_13841
Description: Copper palladium bonding wire introduction
Date of Issue: 28/02/2023 00:00:00
Price (Each)
Qty
Price
160
£4.69000
320
£4.50000
480
£4.32000
640
£4.21000
800+
£4.18000
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