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STM32F103RET6

STMICROELECTRONICS

LQFP64 CORTEX M3 512K FLASH

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	1568
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	17/02/2025
Total Stock Due	7680
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	160
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	1
Order Multiple	1
Date Code (YYWW)	2238+

Package Type: Tray

RoHS:

Moisture Sensitive

Tariff Code: 8542319000

ECCN: 3A991A2

Specification

›

A/D Converters	16 x 12 bit
Architecture	ARM Cortex-M3
Brand	STMICROELECTRONICS
Case or Package Type	LQFP64
Clock / Speed	72 MHz
Core Size	32 bit
D/A Converters	2 x 12 bit
Inputs / Outputs	51
Interface	CAN, I2C, IrDA, LIN, SPI, USART, USB
Internal Oscillator	Yes
Memory Type	FLASH
Operating Temperature	-40°C to +85°C
Program Memory	512K x 8
RAM Size	64K x 8
Supply Voltage	2V to 3.6V

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: MMS-MIC/09/4944 Description: Qualification of ST Muar (Malaysia) TQFP 10x10 assembly Date of Issue: 18/09/2009 00:00:00
PCN Number: MMS-MIC/10/5756 Description: Qualification of a new wafer fab for STM32F10x high & small density devices Date of Issue: 16/07/2010 00:00:00
PCN Number: PCN MMS-MIC_12_7248 Description: Package assembly material change Date of Issue: 30/04/2012 00:00:00
PCN Number: PIL MMS-MIC_12_7428 Description: Additional EWS site for STM8 and STM32 devices - Standard products Date of Issue: 14/08/2012 00:00:00
PCN Number: PCN_7759 Description: New die revision Date of Issue: 26/03/2013 00:00:00
PCN Number: PIL MMS-MIC_13_7803 Description: Addendum PIL7759 - New die revision for STM32F10x (128K, 512K) products Date of Issue: 26/04/2013 00:00:00
PCN Number: st_PCN MMS-MIC_14_8685 Description: Conversion to High Density Matrix Leadframe Date of Issue: 03/10/2014 00:00:00
PCN Number: st_PCN_MMS_15_9108 Description: Amkor ATP (Philippines) additional back-end source Date of Issue: 25/06/2015 00:00:00
PCN Number: st_PCN CRP_16_9871 Description: Standardization of Inner Customized Label Size Date of Issue: 28/07/2016 00:00:00
PCN Number: st_PCN_MDG_17_9976 Description: Transfer assembly plant from Stats ChipPAC Shanghai China (SCC) to Stats ChipPAC Jiangyin China (JSCC) Date of Issue: 03/03/2017 00:00:00
PCN Number: st_PCN MDG_18_10548 Description: ASE Kaohsiung (Taiwan) additional source for LQFP 7x7 & LQFP 10x10 extended listed products Date of Issue: 14/12/2018 00:00:00
PCN Number: st_PCN CRP_19_11361 Description: LAX Hub move preparation Date of Issue: 01/03/2019 00:00:00
PCN Number: st_PCN MDG_19_11628 Description: ST Muar (Malaysia) HD line capacity extension STM8 & STM32 LQFP 10x10 64L additional products Date of Issue: 05/07/2019 00:00:00
PCN Number: st_PCN MDG_20_12050 Description: JSCC capacity increase - for listed products Date of Issue: 13/03/2020 00:00:00
PCN Number: st_PCN CRP_20_12482 Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life Date of Issue: 21/01/2021 00:00:00
PCN Number: MDG/22/13318 Description: ST MUAR Enhanced traceability with 2D marking Date of Issue: 03/11/2022 00:00:00

Price (Each)

Qty	Price
1	£5.11000
11	£4.90000
101	£4.71000
251	£4.59000
501+	£4.56000

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STM32F103RET6

STMICROELECTRONICS

LQFP64 CORTEX M3 512K FLASH

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