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STM32F205VGT6

STMICROELECTRONICS

LQFP 100 14X14X1.4 1

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 80
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 90
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Date Code (YYWW)2408+
Package Type: Tray IC
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 3A991A2
CoO: Malaysia

Specification

BrandSTMICROELECTRONICS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_PCN 10333
Description: TSMC (Taiwan) additional source for STM32F209 1MB & STM32F46 1MB products in M10/90nm technology
Date of Issue: 24/11/2017 00:00:00
PCN1
PCN Number: st_PCN MDG_19_10689
Description: ASE Kaohsiung (Taiwan) additional source for LQFP 14x14 package products
Date of Issue: 24/01/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_19_11361
Description: LAX Hub move preparation
Date of Issue: 01/03/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_19_10994
Description: ST Muar (Malaysia) back-End line capacity extension
Date of Issue: 15/11/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: MDG/22/13318
Description: ST MUAR Enhanced traceability with 2D marking
Date of Issue: 03/11/2022 00:00:00
PCN1PCN2
PCN Number: st_PCN_MDG_23_13841
Description: Copper palladium bonding wire introduction
Date of Issue: 28/02/2023 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£7.54000
541£7.23000
1081£6.94000
1621£6.77000
2161+£6.72000
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