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VIPER06LN

STMICROELECTRONICS

PDIP7 VIPERPLUS

VIPER06LN
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Order Multiple 50
Package Type: Tube
Tariff Code: 8541290000
ECCN: NLR

Specification

BrandSTMICROELECTRONICS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_PCN IPG-IPC_14_8734
Description: Assembling and testing transfer from ST LONGGANG to NANTONG FUJITSU subcon and to ST MUAR
Date of Issue: 17/10/2014 00:00:00
PCN1
PCN Number: st_PCN_AMG_17_10056
Description: VIPER06 datasheet update
Date of Issue: 03/03/2017 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN AMS_19_11888
Description: Transfer of Final Testing (FT) from MUAR-ST to TFME-Subcon.
Date of Issue: 13/12/2019 00:00:00
PCN1
PCN Number: st_PCN AMS_20_11886
Description: New molding compound for DIP package to replace SAMSUNG SDI under termination phase
Date of Issue: 31/01/2020 00:00:00
PCN1
PCN Number: AMS/22/13129
Description: BOM Changes (LF plating and DA) on VIPER products (TFME subcon as assy plant)
Date of Issue: 10/01/2022 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
50£0.50900
100£0.46200
150+£0.41600
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