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ADG5233BCPZ-RL7

ANALOG DEVICES

LATCHUP PROOF 20V 3XSPDT

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	0
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	1500
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	1
Order Multiple	1

Package Type: Tape & Reel

RoHS:

Moisture Sensitive

Tariff Code: 8542399000

ECCN: NLR

CoO: China

Specification

›

Brand

ANALOG DEVICES

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: PCN 13_0230 Description: Assembly and Test Transfer to STATS ChipPAC China Date of Issue: 22/10/2013 00:00:00
PCN Number: PCN 13_0248 Description: Assembly and Test Transfer Date of Issue: 07/11/2013 00:00:00
PCN Number: PCN 13_0230 Rev. A Description: Assembly and Test Transfer revision update Date of Issue: 12/11/2013 00:00:00
PCN Number: ad_pcn_13_0248 Rev. A Description: Assembly and Test Transfer of LFCSP products using 8900 Die Attach to STATS ChipPAC China Date of Issue: 14/07/2014 00:00:00
PCN Number: ad_PCN 13_0248 Rev. B Description: Assembly and Test Transfer update Date of Issue: 29/09/2014 00:00:00
PCN Number: ad_PCN 15_0160 Description: ADG5233 and ADG5234 LFCSP Redesign resulting in Data Sheet Specification Change Date of Issue: 30/07/2015 00:00:00
PCN Number: ad_PCN 16_0036 Rev. A Description: Assembly Relocation to Jiangyin & Test Transfer to Singapore of Select LFCSP Products Date of Issue: 16/03/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. B Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products Date of Issue: 06/05/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. C Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore Update Date of Issue: 31/07/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. D Description: Assembly Relocation update Date of Issue: 21/10/2016 00:00:00
PCN Number: PCN 21_0271 Description: Qualification of an Alternate Adhesive Material and Molding Compound Date of Issue: 08/07/2022 00:00:00
PCN Number: ad_PCN 21_0271 Rev. B Description: Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Date of Issue: 12/08/2022 00:00:00
PCN Number: PCNANA0095 Description: Qualification of an Alternate Adhesive Material and Molding Compound Date of Issue: 02/07/2023 00:00:00
PCN Number: PCNANA0096 Description: Additional adhesive material and molding compound for increased capability. Date of Issue: 17/07/2023 00:00:00

Price (Each)

Qty	Price
1	£3.91000
101	£3.31000
251	£2.69000
751	£2.67000
1501+	£2.65000

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ADG5233BCPZ-RL7

ANALOG DEVICES

LATCHUP PROOF 20V 3XSPDT

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Specification

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Price (Each)

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