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ADUC7023BCP6Z62IRL

ANALOG DEVICES

FLASH ARM7+8-CH 12-B ADC & 4X1

ADUC7023BCP6Z62IRL
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below 16/12/2024
Total Stock Due 2500
Total Reserved Stock Due 0
Supplier Lead Time (wk) 3
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 2500
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Package Type: Tape & Reel
Moisture Sensitive
High Reliability Part
Tariff Code: 8542399000
ECCN: 5A991.b.5
CoO: China

Specification

A/D Converters12 x 12 bit
ArchitectureARM7
BrandANALOG DEVICES
Case or Package TypeVFQFN-EP40
Clock / Speed44 MHz
Core Size32 bit
D/A Converters4 x 12 bit
Inputs / Outputs20
InterfaceI2C, SPI
Internal OscillatorYes
Memory TypeFLASH
Operating Temperature-40°C to +125°C
Program Memory62K x 8
RAM Size8K x 8
Supply Voltage2.7V to 3.6V
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: AD_PCN 13_0233 Rev. D
Description: Assembly Transfer of Select 6x6 and 7x7mm LFCSP Products to STATS ChipPAC China
Date of Issue: 23/05/2014 00:00:00
PCN1PCN2
PCN Number: ad_pcn_PCN 14_0163
Description: Data Sheet & Silicon Anomaly Sheet updates
Date of Issue: 07/07/2014 00:00:00
PCN1
PCN Number: ad_PCN 16_0035
Description: Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin
Date of Issue: 15/02/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0035 Rev. A
Description: Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin
Date of Issue: 16/05/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0131
Description: ADuC7023 Kernel Change
Date of Issue: 20/06/2016 00:00:00
PCN1
PCN Number: ad_PCN 16_0035 Rev. B
Description: Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin Update
Date of Issue: 01/08/2016 00:00:00
PCN1PCN2
PCN Number: ad_PCN 16_0131 Rev. A
Description: ADuC7023 Kernel Change
Date of Issue: 25/10/2018 00:00:00
PCN1
PCN Number: PCN 21_0271 Rev. A
Description: Qualification of an Alternate Adhesive Material and Molding Compound Rev. A
Date of Issue: 18/07/2022 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£5.93000
101£5.02000
501£4.08000
1251£4.05000
2501+£4.03000
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