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Semiconductors
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Clock Timing & Management
/
Clock Buffers & Drivers
ADCLK944BCPZ-R7
ANALOG DEVICES
1/4 HIGH PERFORMANCE LVPECL CL
Image is for illustrative purposes only. Please refer to product data sheet.
Availability
Stock
0
Reserved Stock
0
Stock Due Date
Date next shipment is due, this may not be for the full quantity shown below
-
Total Stock Due
0
Total Reserved Stock Due
0
Supplier Lead Time (wk)
(See Lead Time Forecast)
12
Standard Pack Qty
non-stocked items may be subject to a higher supplier minimum order quantity
1500
Minimum Order Qty
non-stocked items may be subject to a higher supplier minimum order quantity
1
Order Multiple
1
Package Type: Tape & Reel
RoHS:
Moisture Sensitive
Tariff Code: 8542399000
ECCN: NLR
CoO: China
Specification
›
Brand
ANALOG DEVICES
Case or Package Type
LFCSP-WQ16
Frequency
7 GHz
Input:Output Differential
Yes/Yes
Input:Output Ratio
1:4
Mounting Type
Surface Mount
No. of Circuits
1
Operating Temperature
-40°C to +85°C
Output Type
ECL, LVPECL
Supply Voltage
2.375V - 3.63V
Type
Fanout Buffer
Input Type
CML, CMOS, LVDS, LVPECL
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details
PCN PTN
›
PCN (Product Change Notification)
PCN Number: AD_PCN 13_0223 Rev. B
Description: Remove parts & Include Qualification and Test Correlation Report Summary.
Date of Issue: 28/04/2014 00:00:00
PCN Number: ad_PCN 13_0223 Rev. C
Description: Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China
Date of Issue: 06/08/2014 00:00:00
PCN Number: ad_PCN 16_0036
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 11/02/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. B
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 06/05/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. C
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore Update
Date of Issue: 31/07/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. D
Description: Assembly Relocation update
Date of Issue: 21/10/2016 00:00:00
PCN Number: PCN 21_0271 Rev. A
Description: Qualification of an Alternate Adhesive Material and Molding Compound Rev. A
Date of Issue: 18/07/2022 00:00:00
PCN Number: PCN 21_0271
Description: Qualification of an Alternate Adhesive Material and Molding Compound
Date of Issue: 08/07/2022 00:00:00
Price (Each)
Qty
Price
1
£6.23000
101
£5.27000
251
£4.28000
751
£4.26000
1501+
£4.23000
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Qty
Resources
Data Sheet
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