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Semiconductors
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Driver & Interface
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Sensor Interfaces
AD9945KCPZ
ANALOG DEVICES
12 BIT 40 MSPS CONVERTER
Image is for illustrative purposes only. Please refer to product data sheet.
Availability
Stock
0
Reserved Stock
0
Stock Due Date
Date next shipment is due, this may not be for the full quantity shown below
09/12/2024
Total Stock Due
1507
Total Reserved Stock Due
0
Supplier Lead Time (wk)
(See Lead Time Forecast)
3
Standard Pack Qty
non-stocked items may be subject to a higher supplier minimum order quantity
490
Minimum Order Qty
non-stocked items may be subject to a higher supplier minimum order quantity
1
Order Multiple
1
Package Type: Tray IC
RoHS:
Moisture Sensitive
Tariff Code: 8542319000
ECCN: NLR
CoO: China
Specification
›
Brand
ANALOG DEVICES
Case or Package Type
LFCSP-VQ32
Data Interface
Serial
Mounting Type
Surface Mount
Output Type
Logic
Type
CCD 12 bit
Input Type
Logic
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details
PCN PTN
›
PCN (Product Change Notification)
PCN Number: PCN 12_0226
Description: Punched to Sawn Leadframe and Transfer of Backend Process to STATSChipPAC Malaysia
Date of Issue: 14/09/2012 00:00:00
PCN Number: PCN 13_0230 Rev. B
Description: Assembly & Transfer to STSTS ChipPAC China
Date of Issue: 24/12/2013 00:00:00
PCN Number: ad_PCN 13_0230 Rev. F
Description: Assembly and Test Transfer of LFCSP Products to STATS ChipPAC China
Date of Issue: 06/08/2014 00:00:00
PCN Number: ad_pcn_13_0230 Rev. F
Description: Assembly & Test Transfer of LFCSP products to STATS ChipPAC China
Date of Issue: 06/08/2014 00:00:00
PCN Number: ad_PCN 16_0036
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 11/02/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. B
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Date of Issue: 06/05/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. C
Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore Update
Date of Issue: 31/07/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. D
Description: Assembly Relocation update
Date of Issue: 21/10/2016 00:00:00
PCN Number: PCN 21_0271
Description: Qualification of an Alternate Adhesive Material and Molding Compound
Date of Issue: 08/07/2022 00:00:00
POA
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