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STM32F217IGH6

STMICROELECTRONICS

LQFP176 ETHERNET + U MCU

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	2016
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	168
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	1
Order Multiple	1
Date Code (YYWW)	2316+

Package Type: Tray

RoHS:

Moisture Sensitive

Tariff Code: 8542319000

ECCN: 5A002A4

Specification

›

A/D Converters	24 x 12 bit
Architecture	ARM Cortex-M3
Brand	STMICROELECTRONICS
Case or Package Type	UFBGA176
Clock / Speed	120 MHz
Core Size	32 bit
D/A Converters	2 x 12 bit
Inputs / Outputs	140
Interface	CAN, I2C, IrDA, SPI, USART, USB
Internal Oscillator	Yes
Memory Type	FLASH
Operating Temperature	-40°C to +85°C
Program Memory	1M x 8
RAM Size	132K x 8
Supply Voltage	1.8V to 3.6V

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: PIL_MMS-MIC/12/7220_13/04/20121 Description: Decrease Low Speed Oscillator consumption for low power applications Date of Issue: 13/04/2012 00:00:00
PCN Number: PCN_PIL MMS-MIC_12_7264_11/05/2012 Description: Decrease Low Speed Oscillator consumption for low power applications Date of Issue: 11/05/2012 00:00:00
PCN Number: PIL MMS-MIC_12_7428 Description: Additional EWS site for STM8 and STM32 devices - Standard products Date of Issue: 14/08/2012 00:00:00
PCN Number: PIL MMS-MIC_12_7477 Description: Current consumption Reduction in VBAT mode Date of Issue: 11/09/2012 00:00:00
PCN Number: PCN 7747 Description: ST Crolles Wafer Fab additional source in 12" wafers Date of Issue: 18/03/2013 00:00:00
PCN Number: PIL MMS-MIC_13_8156 Description: STM32F2xx EMI characteristics update Date of Issue: 16/10/2013 00:00:00
PCN Number: ST_PCN MMS-MIC_14_8461 Description: Low-speed external oscillator improvement Date of Issue: 01/07/2014 00:00:00
PCN Number: st_pcn_mms-mic_14_8385 Description: UFBGA Transfer back-end site from Amkor ATK (Korea) to Amkor ATP (Philippines) & Features improvements. Date of Issue: 10/07/2014 00:00:00
PCN Number: st_PCN MMS_15_9045 Description: ST Muar (Malaysia) additional source - UFBGA7x7 and UFBGA10x10 products Date of Issue: 21/12/2015 00:00:00
PCN Number: st_PCN CRP_16_9871 Description: Standardization of Inner Customized Label Size Date of Issue: 28/07/2016 00:00:00
PCN Number: st_PCN 10333 Description: TSMC (Taiwan) additional source for STM32F209 1MB & STM32F46 1MB products in M10/90nm technology Date of Issue: 24/11/2017 00:00:00
PCN Number: st_PCN MDG_19_10690 Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products Date of Issue: 15/03/2019 00:00:00
PCN Number: st_PCN CRP_20_12482 Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life Date of Issue: 21/01/2021 00:00:00
PCN Number: ST-MDG-21-12542-Die Cast Change 2108 Description: Die Cast Change Date of Issue: 23/02/2021 00:00:00
PCN Number: ST-PCN-12802 Markings 2122 Description: Change of Markings Date of Issue: 31/05/2021 00:00:00
PCN Number: ST-PCN12791 Die 2128 Description: Die Redesign Date of Issue: 16/07/2021 00:00:00
PCN Number: MDG/21/12916 Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility Date of Issue: 13/12/2021 00:00:00
PCN Number: PCNSTM4199 Description: qualification of a second source substrate supplier Date of Issue: 20/08/2023 00:00:00
PCN Number: PCNSTM2414374 Description: copper palladium bonding wire introduction Date of Issue: 24/09/2024 00:00:00

Price (Each)

Qty	Price
1	£10.04000
11	£9.63000
101	£9.25000
251	£9.01000
501+	£8.95000

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STM32F217IGH6

STMICROELECTRONICS

LQFP176 ETHERNET + U MCU

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