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BUL654

STMICROELECTRONICS

BUL654

BUL654
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Order Multiple 50
Package Type: Tube
Tariff Code: 8541290000
ECCN: NLR

Specification

BrandSTMICROELECTRONICS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: MPA/06/2113
Description: New Molding compound for TO-220
Date of Issue: 30/10/2006 00:00:00
PCN1PCN2
PCN Number: PCN IPD_13_7945
Description: Capacity expansion, for product housed in TO-220 package at the China Subcontractor plant
Date of Issue: 18/06/2013 00:00:00
PCN1
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN ADG_19_11736
Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL
Date of Issue: 26/09/2019 00:00:00
PCN1PCN2

POA

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