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STP10NM60N

STMICROELECTRONICS

MOSFET 600V 0.55OHM

STP10NM60N
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 50
Order Multiple 50
Tariff Code: 8541290000
ECCN: NLR

Specification

BrandSTMICROELECTRONICS
Continuous Drain Current10 A
Drain-Source Voltage600 V
Gate-Source V(th)4 V
Input Capacitance540 pF
Mounting TypeThrough Hole
Power Dissipation160 W
Rds (on)550 mohm
TypeN-Channel
Case or Package TypeTO220
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: PCN IPD-PWR_13_7687
Description: Package assembly material change
Date of Issue: 29/01/2013 00:00:00
PCN1
PCN Number: PCN IPD_13_7945
Description: Capacity expansion, for product housed in TO-220 package at the China Subcontractor plant
Date of Issue: 18/06/2013 00:00:00
PCN1
PCN Number: st_PCN IPG-PWR_14_8603
Description: MDmesh II Technology, Power MOSFET Transistors, 8" Wafer size Front-end Capacity Extension - Ang Mo Kio
Date of Issue: 21/07/2014 00:00:00
PCN1
PCN Number: st_PCN CRP_16_9871
Description: Standardization of Inner Customized Label Size
Date of Issue: 28/07/2016 00:00:00
PCN1
PCN Number: st_PCN ADG_17_10121
Description: TO-220 New marking Composition - Bouskoura (Morocco)
Date of Issue: 10/03/2017 00:00:00
PCN1PCN2
PCN Number: st_PCN ADG_18_11251
Description: TO-220 Plating Process Capacity Extension - Dongguan Syundai (China) - INDUSTRIAL
Date of Issue: 14/12/2018 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN ADG_19_11736
Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL
Date of Issue: 26/09/2019 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
50£0.68400
100£0.62000
150£0.58800
200£0.49300
250+£0.48600

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