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Semiconductor Discretes
/
Transistors
/
Bipolar Transistors
TIP2955
STMICROELECTRONICS
TO247 P 90W 15A 100V
Image is for illustrative purposes only. Please refer to product data sheet.
Availability
Stock
4674
Reserved Stock
0
Stock Due Date
Date next shipment is due, this may not be for the full quantity shown below
-
Total Stock Due
0
Total Reserved Stock Due
0
Supplier Lead Time (wk)
(See Lead Time Forecast)
18
Standard Pack Qty
non-stocked items may be subject to a higher supplier minimum order quantity
30
Minimum Order Qty
non-stocked items may be subject to a higher supplier minimum order quantity
1
Order Multiple
1
Date Code
1427+
Package Type: Tube
RoHS:
Tariff Code: 8541290000
ECCN: NLR
Specification
›
Brand
STMICROELECTRONICS
Case or Package Type
TO247
Collector Current
15 A
Collector-Emitter V(br)
60 V
Collector-Emitter V(sat)
3 V
DC Current Gain (hFE)
20
Mounting Type
Through Hole
Power
90 W
Type
PNP
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details
PCN PTN
›
PCN (Product Change Notification)
PCN Number: APM-PWR/07/2362
Description: Package change from TO218 to TO247 for Power Bipolar products
Date of Issue: 19/03/2007 00:00:00
PCN Number: APM/07/2904
Description: New Molding compound for TO- 247
Date of Issue: 25/10/2007 00:00:00
PCN Number: APM-PWR/08/3877
Description: SILICON LINE CHANGE FOR BIPOLAR DEVICES - BI22 PRODUCT LINE
Date of Issue: 21/07/2008 00:00:00
PCN Number: APM-PWR/10/5868
Description: Package assembly material change
Date of Issue: 02/09/2010 00:00:00
PCN Number: ST_PCN IPG_14_8475
Description: Package assembly location change
Date of Issue: 16/05/2014 00:00:00
PCN Number: st_pcn_IPG-PWR_14_8674
Description: Packaging Back-End Capacity Extension - Nantong Fujitsu Microelectronics (China)
Date of Issue: 02/09/2014 00:00:00
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN Number: st_PCN ADG_19_11736
Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL
Date of Issue: 26/09/2019 00:00:00
Price (Each)
Qty
Price
1
£0.53500
31
£0.48600
61+
£0.43700
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