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M24C02-WMN6TP

STMICROELECTRONICS

EEPROM I2CB 2K

M24C02-WMN6TP
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 10909
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 16
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 2500
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Date Code2240+
Package Type: Tape & Reel
Tariff Code: 8542326100
ECCN: NLR

Specification

BrandSTMICROELECTRONICS
Case or Package TypeSO8
Clock Frequency400 kHz
Data InterfaceSerial, I2C
Operating Temperature-40°C to +85°C
Size & Organisation2K (256x8)
Supply Voltage2.5V - 5.5V
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: MMS-SNV/07/2474
Description: Gold bonding wire diameter change for all EEPROM products assembled in SO8N package
Date of Issue: 25/04/2007 00:00:00
PCN1PCN2
PCN Number: PCN_CRP_12_7398
Description: Conversion to Peel-able Customized Labels for Reels
Date of Issue: 23/07/2012 00:00:00
PCN1
PCN Number: PCN MMS-MMY_12_7619
Description: Redesign and upgrade to the new CMOSF8H+ process technology
Date of Issue: 07/12/2012 00:00:00
PCN1
PCN Number: st_PCN_CRP_15_9379
Description: SHIELDING BAG for SHENZHEN 4-layer Pre plated frame SO8 & TSSOP8 REELS AND TUBES
Date of Issue: 03/09/2015 00:00:00
PCN1PCN2
PCN Number: st_CRP_16_9465
Description: Moisture Barrier Bag change
Date of Issue: 09/05/2016 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_16_9871
Description: Standardization of Inner Customized Label Size
Date of Issue: 28/07/2016 00:00:00
PCN1
PCN Number: st_PCN CRP_19_11361
Description: LAX Hub move preparation
Date of Issue: 01/03/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN CPR_19_11772
Description: Inner Box Change for Automation Packing
Date of Issue: 01/11/2019 00:00:00
PCN1PCN2
PCN Number: MDG/22/13487
Description: ST Ang Mo Kio (Singapore) additional wafer fab
Date of Issue: 08/06/2022 00:00:00
PCN1PCN2
PCN Number: PCNANA14399
Description: Introduction of plasma dicing
Date of Issue: 17/11/2023 00:00:00
PCN1

Price (Each)

QtyPrice
1£0.07342
2501£0.06662
5001+£0.05996
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