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STM32F745IGK7

STMICROELECTRONICS

UFBGA176 HP DSP W/FPU C-M7

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 168
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 168
Order Multiple 168
Package Type: Tray IC
Tariff Code: 8542319000
ECCN: 3A991A2

Specification

BrandSTMICROELECTRONICS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: ST-MDG-21-12542-Die Cast Change 2108
Description: Die Cast Change
Date of Issue: 23/02/2021 00:00:00
PCN1
PCN Number: ST-PCN-12802 Markings 2122
Description: Change of Markings
Date of Issue: 31/05/2021 00:00:00
PCN1
PCN Number: MDG/21/12916
Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility
Date of Issue: 13/12/2021 00:00:00
PCN1PCN2
PCN Number: PCNSTM2414374
Description: copper palladium bonding wire introduction
Date of Issue: 24/09/2024 00:00:00
PCN1

Price (Each)

QtyPrice
168£10.53000
336£10.09000
504£9.70000
672£9.45000
840+£9.39000
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