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STM32F412VEH3TR

STMICROELECTRONICS

UFBGA100 ARM CORTEX-M4 MCU T/R

STM32F412VEH3TR
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) 12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 2500
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 2500
Order Multiple 2500
Package Type: Tape & Reel
Tariff Code: 8542319000
ECCN: 3A991A2

Specification

BrandSTMICROELECTRONICS
Core Size32 bit
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_PCN MDG_18_10671
Description: TSMC (Taiwan) additional source for STM32F4 products in M10/90nm technology
Date of Issue: 15/06/2018 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_19_10690
Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products
Date of Issue: 15/03/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: ST-MDG-21-12542-Die Cast Change 2108
Description: Die Cast Change
Date of Issue: 23/02/2021 00:00:00
PCN1
PCN Number: ST-PCN-12802 Markings 2122
Description: Change of Markings
Date of Issue: 31/05/2021 00:00:00
PCN1
PCN Number: MDG/21/12916
Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility
Date of Issue: 13/12/2021 00:00:00
PCN1PCN2
PCN Number: PCNSTM2414374
Description: copper palladium bonding wire introduction
Date of Issue: 24/09/2024 00:00:00
PCN1

Price (Each)

QtyPrice
2500£5.02000
5000£4.82000
7500£4.63000
10000£4.51000
12500+£4.48000
Looking for higher volume pricing? Volume enquiries

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