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STM32L4S9AII6

STMICROELECTRONICS

UFBGA169 ARM CORTEX-M4 MCU

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	0
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	416
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	416
Order Multiple	416

Package Type: Tray

RoHS:

Moisture Sensitive

Tariff Code: 8542319000

ECCN: 5A002A4

Specification

›

Architecture	ARM Cortex-M4
Brand	STMICROELECTRONICS
Case or Package Type	UFBGA169
Clock / Speed	120 MHz
Core Size	32 bit
Inputs / Outputs	131
Internal Oscillator	Yes
Memory Type	FLASH
Operating Temperature	-40°C to +85°C
Program Memory	2M x 8
RAM Size	640K x 8
Supply Voltage	1.71V to 3.6V

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: st_PCN MDG_18_10715 Description: Datasheets update Date of Issue: 01/06/2018 00:00:00
PCN Number: st_PCN MDG_18_11255 Description: STM32L4R/S products improvements Date of Issue: 21/12/2018 00:00:00
PCN Number: st_PCN MDG_19_10690 Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products Date of Issue: 15/03/2019 00:00:00
PCN Number: st_PCN MDG_19_11702 Description: STM32L4R/S products firmware improvement Date of Issue: 15/11/2019 00:00:00
PCN Number: st_PCN CRP_20_12482 Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life Date of Issue: 21/01/2021 00:00:00
PCN Number: ST-MDG-21-12542-Die Cast Change 2108 Description: Die Cast Change Date of Issue: 23/02/2021 00:00:00
PCN Number: ST-PCN-12802 Markings 2122 Description: Change of Markings Date of Issue: 31/05/2021 00:00:00
PCN Number: MDG/21/12916 Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility Date of Issue: 13/12/2021 00:00:00
PCN Number: PCNSTM2414374 Description: copper palladium bonding wire introduction Date of Issue: 24/09/2024 00:00:00

Price (Each)

Qty	Price
416	£8.24000
832	£7.90000
1248	£7.59000
1664	£7.39000
2080+	£7.35000

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STM32L4S9AII6

STMICROELECTRONICS

UFBGA169 ARM CORTEX-M4 MCU

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