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STM32F205RBT6TR

STMICROELECTRONICS

ARM CORTEX-M3 MCU 128 KBYTES

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 0
Reserved Stock 75000
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below 07/02/2025
Total Stock Due 52000
Total Reserved Stock Due 2000
Supplier Lead Time (wk) 12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 1000
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Date Code (YYWW)2404+
Package Type: Tape & Reel
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 3A991A2

Specification

BrandSTMICROELECTRONICS
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: st_PCN_MDG_17_9976
Description: Transfer assembly plant from Stats ChipPAC Shanghai China (SCC) to Stats ChipPAC Jiangyin China (JSCC)
Date of Issue: 03/03/2017 00:00:00
PCN1PCN2
PCN Number: st_PCN 10333
Description: TSMC (Taiwan) additional source for STM32F209 1MB & STM32F46 1MB products in M10/90nm technology
Date of Issue: 24/11/2017 00:00:00
PCN1
PCN Number: st_PCN MDG_18_10548
Description: ASE Kaohsiung (Taiwan) additional source for LQFP 7x7 & LQFP 10x10 extended listed products
Date of Issue: 14/12/2018 00:00:00
PCN1PCN2
PCN Number: st_PCN MDG_20_12050
Description: JSCC capacity increase - for listed products
Date of Issue: 13/03/2020 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: st_PCN_MDG_23_13841
Description: Copper palladium bonding wire introduction
Date of Issue: 28/02/2023 00:00:00
PCN1PCN2

Price (Each)

QtyPrice
1£4.59000
11£4.40000
101£4.23000
251£4.12000
501+£4.09000
Looking for higher volume pricing? Volume enquiries

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