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STM32F429AGH6

STMICROELECTRONICS

BGA169 ARM CORTEX-M4 CORE

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	0
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	416
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	416
Order Multiple	416

Package Type: Tray IC

RoHS:

Tariff Code: 8542319000

ECCN: 3A991A2

Specification

›

Architecture	ARM Cortex-M4
Brand	STMICROELECTRONICS
Case or Package Type	UFBGA169
Clock / Speed	180 MHz
Core Size	32 bit
Inputs / Outputs	130
Internal Oscillator	Yes
Memory Type	FLASH
Operating Temperature	-40°C to +85°C
Program Memory	1M x 8
RAM Size	256K x 8
Supply Voltage	1.8V to 3.6V

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: st_PCN MMS_15_9045 Description: ST Muar (Malaysia) additional source - UFBGA7x7 and UFBGA10x10 products Date of Issue: 21/12/2015 00:00:00
PCN Number: st_PCN_MDG_16_9902 Description: Rousset manufacturing additional plant and mask adjustment Date of Issue: 16/12/2016 00:00:00
PCN Number: st_PCN MDG_18_10595 Description: TSMC (Taiwan) additional source for STM32F427/9 & STM32F437/9 products in M10/90nm technology Date of Issue: 16/03/2018 00:00:00
PCN Number: st_PCN MDG_19_10690 Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products Date of Issue: 15/03/2019 00:00:00
PCN Number: st_PCN CRP_20_12482 Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life Date of Issue: 21/01/2021 00:00:00
PCN Number: ST-MDG-21-12542-Die Cast Change 2108 Description: Die Cast Change Date of Issue: 23/02/2021 00:00:00
PCN Number: ST-PCN-12802 Markings 2122 Description: Change of Markings Date of Issue: 31/05/2021 00:00:00
PCN Number: MDG/21/12916 Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility Date of Issue: 13/12/2021 00:00:00
PCN Number: PCNSTM2414374 Description: copper palladium bonding wire introduction Date of Issue: 24/09/2024 00:00:00

Price (Each)

Qty	Price
416	£7.83000
832	£7.51000
1248	£7.21000
1664	£7.03000
2080+	£6.98000

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STM32F429AGH6

STMICROELECTRONICS

BGA169 ARM CORTEX-M4 CORE

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PCN PTN

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