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STM32F207ICH6

STMICROELECTRONICS

BGA176 ETHERNET + US

STM32F207ICH6
Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock 28
Reserved Stock 0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below -
Total Stock Due 0
Total Reserved Stock Due 0
Supplier Lead Time (wk) Consult Anglia
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity 168
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity 1
Order Multiple 1
Date Code (YYWW)1422+
Package Type: Tray IC
Moisture Sensitive
Tariff Code: 8542319000
ECCN: 3A991A2

Specification

BrandSTMICROELECTRONICS
Core Size32 bit
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

PCN (Product Change Notification)
PCN Number: sa_PCN MMS_15_9045
Description: ST Muar (Malaysia) additional source - UFBGA7x7 and UFBGA10x10 products
Date of Issue: 21/12/2015 00:00:00
PCN1PCN2
PCN Number: st_PCN 10333
Description: TSMC (Taiwan) additional source for STM32F209 1MB & STM32F46 1MB products in M10/90nm technology
Date of Issue: 24/11/2017 00:00:00
PCN1
PCN Number: st_PCN MDG_19_10690
Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products
Date of Issue: 15/03/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN ADG_19_11491
Description: Mold compound replacement for TO92
Date of Issue: 12/04/2019 00:00:00
PCN1PCN2
PCN Number: st_PCN CRP_20_12482
Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life
Date of Issue: 21/01/2021 00:00:00
PCN1PCN2
PCN Number: MDG/21/12916
Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility
Date of Issue: 13/12/2021 00:00:00
PCN1PCN2
PCN Number: PCNSTM4199
Description: qualification of a second source substrate supplier
Date of Issue: 20/08/2023 00:00:00
PCN1

POA

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