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MR0A16AYS35

EVERSPIN TECHNOLOGIES INC.

TSOP44 MRAM 1MB (64KX16) PAR

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	0
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	20
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	135
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	1
Order Multiple	1

Package Type: Tray IC

RoHS:

Moisture Sensitive

Tariff Code: 8542326900

ECCN: NLR

CoO: Taiwan (Province of China)

Specification

›

Brand	EVERSPIN TECHNOLOGIES INC.
Case or Package Type	TSOP44
Data Interface	Parallel
Operating Temperature	0°C to +70°C
Size & Organisation	1M (64Kx16)
Speed	35 ns
Supply Voltage	3V - 3.6V

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: evs_PCN03000 Description: Everspin is changing the die attach material for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE. Date of Issue: 21/12/2018 00:00:00
PCN Number: EVS-PCN03031 Die thickness 2115 Description: Die Thickness Change Date of Issue: 15/04/2021 00:00:00
PCN Number: EVS-PCN-PB03032 Label 2115 Description: Label Change Date of Issue: 15/04/2021 00:00:00
PCN Number: EVS-PCN03031 Die 2116 Description: Die Thickness Date of Issue: 13/04/2021 00:00:00
PCN Number: EVS-PCN03043 Description: Adding CMOS Wafer Fab Supplier to Trace Code on Everspin Products Date of Issue: 20/10/2021 00:00:00
PCN Number: PCNEVS041124 Description: Assembly qual site Date of Issue: 11/04/2024 00:00:00

Price (Each)

Qty	Price
1	£11.73000
136+	£10.83000

Qty

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Data Sheet

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Part No: MR0A16AYS35R
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MR0A16AYS35

EVERSPIN TECHNOLOGIES INC.

TSOP44 MRAM 1MB (64KX16) PAR

Availability

Specification

PCN PTN

Price (Each)

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