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STM32F427IIH6

STMICROELECTRONICS

BGA176 2M ENET 2XOTG

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	0
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	168
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	168
Order Multiple	168

Package Type: Tray IC

RoHS:

Moisture Sensitive

Tariff Code: 8542319000

ECCN: 3A991A2

Specification

›

Architecture	ARM Cortex-M4F
Brand	STMICROELECTRONICS
Case or Package Type	BGA176
Core Size	32 bit
Memory Type	FLASH

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: ST_PCN MMS-MIC_14_8451 Description: STM32F4x 2Mbyte products improvement Date of Issue: 27/05/2014 00:00:00
PCN Number: st_pcn_mms-mic_14_8385 Description: UFBGA Transfer back-end site from Amkor ATK (Korea) to Amkor ATP (Philippines) & Features improvements. Date of Issue: 10/07/2014 00:00:00
PCN Number: st_PIL MMS-MIC_14_8569 Description: Errata sheet update Date of Issue: 10/07/2014 00:00:00
PCN Number: st_PCN MMS_15_9045 Description: ST Muar (Malaysia) additional source - UFBGA7x7 and UFBGA10x10 products Date of Issue: 21/12/2015 00:00:00
PCN Number: st_PCN_MDG_16_9902 Description: Rousset manufacturing additional plant and mask adjustment Date of Issue: 16/12/2016 00:00:00
PCN Number: st_PCN MDG_18_10595 Description: TSMC (Taiwan) additional source for STM32F427/9 & STM32F437/9 products in M10/90nm technology Date of Issue: 16/03/2018 00:00:00
PCN Number: st_PCN CRP_19_11361 Description: LAX Hub move preparation Date of Issue: 01/03/2019 00:00:00
PCN Number: st_PCN MDG_19_10690 Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products Date of Issue: 15/03/2019 00:00:00
PCN Number: st_PCN CRP_20_12482 Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life Date of Issue: 21/01/2021 00:00:00
PCN Number: ST-MDG-21-12542-Die Cast Change 2108 Description: Die Cast Change Date of Issue: 23/02/2021 00:00:00
PCN Number: ST-PCN-12802 Markings 2122 Description: Change of Markings Date of Issue: 31/05/2021 00:00:00
PCN Number: MDG/21/12916 Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility Date of Issue: 13/12/2021 00:00:00
PCN Number: PCNSTM4199 Description: qualification of a second source substrate supplier Date of Issue: 20/08/2023 00:00:00
PCN Number: PCNSTM2414374 Description: copper palladium bonding wire introduction Date of Issue: 24/09/2024 00:00:00

Price (Each)

Qty	Price
168	£9.20000
336	£8.82000
504	£8.47000
672	£8.25000
840+	£8.20000

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STM32F427IIH6

STMICROELECTRONICS

BGA176 2M ENET 2XOTG

Availability

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PCN PTN

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