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ADG5234BCPZ-RL7

ANALOG DEVICES

LFCSP20 HV QUAD SPDT SWT

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	0
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	-
Total Stock Due	0
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	15
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	1500
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	1
Order Multiple	1

Package Type: Tape & Reel

RoHS:

Moisture Sensitive

Tariff Code: 8542399000

ECCN: NLR

CoO: China

Specification

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ANALOG DEVICES

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: PCN 13_0230 Description: Assembly and Test Transfer to STATS ChipPAC China Date of Issue: 22/10/2013 00:00:00
PCN Number: PCN 13_0230 Rev. A Description: Assembly and Test Transfer revision update Date of Issue: 12/11/2013 00:00:00
PCN Number: ad_PCN 13_0230 Rev. F Description: Assembly and Test Transfer of LFCSP Products to STATS ChipPAC China Date of Issue: 06/08/2014 00:00:00
PCN Number: ad_pcn_13_0230 Rev. F Description: Assembly & Test Transfer of LFCSP products to STATS ChipPAC China Date of Issue: 06/08/2014 00:00:00
PCN Number: ad_PCN 15_0160 Description: ADG5233 and ADG5234 LFCSP Redesign resulting in Data Sheet Specification Change Date of Issue: 30/07/2015 00:00:00
PCN Number: ad_PCN 16_0036 Rev. A Description: Assembly Relocation to Jiangyin & Test Transfer to Singapore of Select LFCSP Products Date of Issue: 16/03/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. B Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products Date of Issue: 06/05/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. C Description: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore Update Date of Issue: 31/07/2016 00:00:00
PCN Number: ad_PCN 16_0036 Rev. D Description: Assembly Relocation update Date of Issue: 21/10/2016 00:00:00
PCN Number: PCN 21_0271 Description: Qualification of an Alternate Adhesive Material and Molding Compound Date of Issue: 08/07/2022 00:00:00
PCN Number: ad_PCN 21_0271 Rev. B Description: Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Date of Issue: 12/08/2022 00:00:00
PCN Number: PCNANA0095 Description: Qualification of an Alternate Adhesive Material and Molding Compound Date of Issue: 03/07/2023 00:00:00
PCN Number: PCNANA0096 Description: Additional adhesive material and molding compound for increased capability. Date of Issue: 17/07/2023 00:00:00

Price (Each)

Qty	Price
1	£5.54000
101	£4.69000
251	£3.81000
751	£3.78000
1501+	£3.76000

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ADG5234BCPZ-RL7

ANALOG DEVICES

LFCSP20 HV QUAD SPDT SWT

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