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Semiconductor Discretes
/
Transistors
/
IGBT's
STGW40V60F
STMICROELECTRONICS
TO247 IGBT 40A 600V TRENCH GAT
Image is for illustrative purposes only. Please refer to product data sheet.
Availability
Stock
0
Reserved Stock
0
Stock Due Date
Date next shipment is due, this may not be for the full quantity shown below
-
Total Stock Due
0
Total Reserved Stock Due
0
Supplier Lead Time (wk)
(See Lead Time Forecast)
16
Standard Pack Qty
non-stocked items may be subject to a higher supplier minimum order quantity
30
Minimum Order Qty
non-stocked items may be subject to a higher supplier minimum order quantity
30
Order Multiple
30
Package Type: Tube
RoHS:
Tariff Code: 8541290000
ECCN: NLR
Specification
›
Brand
STMICROELECTRONICS
Case or Package Type
TO247
Collector Current
40 A
Collector-Emitter V(br)
600 V
Mounting Type
Through Hole
The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details
PCN PTN
›
PCN (Product Change Notification)
PCN Number: ST_PCN IPG_14_8475
Description: Package assembly location change
Date of Issue: 16/05/2014 00:00:00
PCN Number: st_pcn_IPG-PWR_14_8674
Description: Packaging Back-End Capacity Extension - Nantong Fujitsu Microelectronics (China)
Date of Issue: 02/09/2014 00:00:00
PCN Number: st_PCN ADG_18_11145
Description: IGBT Trench Technology 8 Wafer Front-end Capacity Extension - Ang Mo Kio (S'Pore) - INDUSTRIAL
Date of Issue: 19/10/2018 00:00:00
PCN Number: st_PCN CRP_19_11478
Description: Replacement of current mold compounds with alternative material.
Date of Issue: 12/04/2019 00:00:00
PCN Number: st_PCN ADG_19_11736
Description: New Molding Compound Shenzhen (China) - Bouskoura (Morocco) - Tongfu Microelectronics (China) - INDUSTRIAL
Date of Issue: 26/09/2019 00:00:00
PCN Number: ADG/21/13069
Description: IGBT/IPM TFS Technology Front End Expansion - External Samsung Foundr
Date of Issue: 22/10/2021 00:00:00
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