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STM32F437IIH6

STMICROELECTRONICS

BGA176 2M ENET 2XOTG

Image is for illustrative purposes only. Please refer to product data sheet.

Availability

Stock	8510
Reserved Stock	0
Stock Due Date Date next shipment is due, this may not be for the full quantity shown below	17/02/2025
Total Stock Due	15120
Total Reserved Stock Due	0
Supplier Lead Time (wk) (See Lead Time Forecast)	12
Standard Pack Qty non-stocked items may be subject to a higher supplier minimum order quantity	168
Minimum Order Qty non-stocked items may be subject to a higher supplier minimum order quantity	1
Order Multiple	1
Date Code (YYWW)	2242+

Package Type: Tray

RoHS:

Moisture Sensitive

Tariff Code: 8542319000

ECCN: 5A002A4

Specification

›

Architecture	ARM Cortex-M4
Brand	STMICROELECTRONICS
Case or Package Type	UFBGA176
Clock / Speed	180 MHz
Core Size	32 bit
Inputs / Outputs	140
Internal Oscillator	Yes
Memory Type	FLASH
Operating Temperature	-40°C to +85°C
Program Memory	2M x 8
RAM Size	256K x 8
Supply Voltage	1.8V to 3.6V

The specification data is supplied for search purposes only. Please refer to the product data sheet for full technical details

PCN PTN

›

PCN (Product Change Notification)
PCN Number: PCN MMS-MIC_13_8037 Description: ST Crolles Wafer Fab additional source in 12" wafers Date of Issue: 06/08/2013 00:00:00
PCN Number: ST_PCN MMS-MIC_14_8451 Description: STM32F4x 2Mbyte products improvement Date of Issue: 27/05/2014 00:00:00
PCN Number: st_pcn_mms-mic_14_8385 Description: UFBGA Transfer back-end site from Amkor ATK (Korea) to Amkor ATP (Philippines) & Features improvements. Date of Issue: 10/07/2014 00:00:00
PCN Number: st_PIL MMS-MIC_14_8569 Description: Errata sheet update Date of Issue: 10/07/2014 00:00:00
PCN Number: st_PCN MMS_15_9045 Description: ST Muar (Malaysia) additional source - UFBGA7x7 and UFBGA10x10 products Date of Issue: 21/12/2015 00:00:00
PCN Number: st_PCN CRP_16_9871 Description: Standardization of Inner Customized Label Size Date of Issue: 28/07/2016 00:00:00
PCN Number: st_PCN_MDG_16_9902 Description: Rousset manufacturing additional plant and mask adjustment Date of Issue: 16/12/2016 00:00:00
PCN Number: st_PCN MDG_18_10595 Description: TSMC (Taiwan) additional source for STM32F427/9 & STM32F437/9 products in M10/90nm technology Date of Issue: 16/03/2018 00:00:00
PCN Number: st_PCN MDG_19_10690 Description: ASE Kaohsiung (Taiwan) additional source for UFBGA 5X5 7x7 10x10 package products Date of Issue: 15/03/2019 00:00:00
PCN Number: st_PCN CRP_20_12482 Description: MBB (Material Barrier Bag) : extend print out warning message on shelf life Date of Issue: 21/01/2021 00:00:00
PCN Number: ST-MDG-21-12542-Die Cast Change 2108 Description: Die Cast Change Date of Issue: 23/02/2021 00:00:00
PCN Number: ST-PCN-12802 Markings 2122 Description: Change of Markings Date of Issue: 31/05/2021 00:00:00
PCN Number: MDG/21/12916 Description: SE Kaohsiung (Taiwan) xFBGA package Bonding Wire procurement flexibility Date of Issue: 13/12/2021 00:00:00
PCN Number: PCNSTM4199 Description: qualification of a second source substrate supplier Date of Issue: 20/08/2023 00:00:00
PCN Number: PCNSTM2414374 Description: copper palladium bonding wire introduction Date of Issue: 24/09/2024 00:00:00

Price (Each)

Qty	Price
1	£9.58000
11	£9.19000
101	£8.83000
251	£8.60000
501+	£8.55000

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STM32F437IIH6

STMICROELECTRONICS

BGA176 2M ENET 2XOTG

Availability

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PCN PTN

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