Toshiba Electronics Europe (TEE) has announced a transistor output photocoupler in a low-height, wide body SO6L package, which can be used to replace conventional DIP4 packages. The thermally efficient, miniature DSOP Advance package saves space and improves heat dissipation by more than 30%

The new product TLP385 offers a high isolation performance. It guarantees a minimum creepage and clearance distance of 8mm and isolation voltage of 5kVrms (min).

With a height of just 2.3mm (max), a 45% reduction from DIP4 type package products, the TLP385 can be used in situations where there are strict height limits, aiding the development of ultra low profile products. It can be used for applications including inverter interfaces and general-purpose power supplies.

Operating temperature range is -55 to +110 degrees C. It is approved to UL, cUL and CQC safety standards and is also available as VDE EN60747-5-5 approved type.

Click here for more information and to buy from Anglia Live