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Cinterion EHS5 delivers highly efficient 3G in a 2G footprint

Date Published : 18/12/2012 Share with:

 

The Cinterion EHS5 module represents a milestone in scalable machine-to-machine communication, offering smart connectivity for industrial applications.

EHS5 delivers highly efficient 3G communication in an ultra-compact footprint. The EHS5 is an ideal solution for M2M applications moving to 3G technology with a focus on long-lasting, future-proof and cost efficient M2M applications. Offering a backward and forward compatible footprint, its multi design capability offers seamless migration and unmatched flexibility to choose frequency bands and global roaming whenever needed.

Powered by Intel’s latest HSPA+ baseband, the next generation of the award-winning Evolution platform features high speed data communication with 7.2 Mbps (max) in the downlink and 5.76 Mbps (max) in the uplink.

The tiny EHS5 comes in Cinterion’s unique LGA (Land Grid Array) package perfectly suited to the manufacturing needs of small, high-volume M2M devices with a focus on reliable and efficient processes. EHS5 supports voice and data communication and best in class low power consumption incorporated with common industrial interfaces such as USB and serial interfaces.

EHS5 is available in two variants: EHS5-US (850/1900 MHz) for North America, and EHS5-E (900/2100 MHz) assuring global coverage.

Click here to download the datasheet 

Free Evaluation Kit

Are you new to GSM/GPRS/3G or would you like to evaluate the EHS5?

Anglia is giving away 3G evaluation kits to customers in the UK & Ireland.

Click here for details

 

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